Professor Ndy Ekere

Email address: ndyekere@wlv.ac.uk Phone number: 01902 321703 Location: Faculty: Faculty of Science and Engineering School/Institute: School of Engineering Areas of expertise:

Ndy’s interests are in Electronics Interconnections, Assembly and Packaging and his research projects are mainly focused on increasing science-based understanding of electronics manufacturing processes and materials. He also has a growing interest in Renewable Energy, Battery Storage and other technologies for Energy Infrastructure and technologies for Smart Cities. He holds a first class honours degree in mechanical engineering, a Master of Science degree in flexible manufacturing and robotics from Loughborough University and a PhD in manufacturing engineering from the University of Manchester Institute of Science and Technology; where he also held a postdoctoral research fellowship. He worked as a lecturer, senior lecturer and then professor with the University of Salford before taking up the position of Dean of School of Engineering at the University of Greenwich. He also served as the Dean of School of Technology and later, the pioneer Dean of the Faculty of Science and Engineering here at the University of Wolverhampton. He is a Chartered Engineer, a Fellow of the Institution of Engineering and Technology and a Senior Fellow of the Higher Education Academy.

 

 

About

Ndy’s great passions are in the development of quality learning and teaching modules that encourages self-directed learning; the use of his research and knowledge exchange activities to enrich students’ learning and also the use of his research and knowledge exchange activities for building relationships with the companies and organisations that are likely to employ our graduates. His focus is in engaging our students in active, practice-based learning; and in aligning and using the industry-led applied research and knowledge exchange activities to the benefit of our students; to ensure our students are at the cutting edge of their subjects and professions. His lecturing brief covers a wide range of subjects offered on various BEng (Hons) MEng (Hons) and MSc Degree Programmes. Examples of his current and previous teaching portfolio are listed below:

  • Renewable Energy and Smart Grids
  • Electronics Manufacturing
  • Computer Integrated Manufacturing
  • Manufacturing Systems Simulations
  • Risk Analysis and Management
  • Operations Management
  • Research Methods

Research interests

Professor Ekere has an international presence and reputation in Electronics Manufacturing and Assembly and Reliability Engineering research. This research focuses on identifying and developing suitable assembly/packaging technologies to address the miniaturisation challenge facing the electronics industry. He also has a growing interest in Renewable Energy, Battery Storage and other Technologies for Energy Infrastructure and Technologies for Smart Cities. He has successfully completed 22 research projects as Principal Investigator with over £2.9m funding; most of these with the UK Engineering and Physical Sciences Research Council (http://gow.epsrc.ac.uk/NGBOViewPerson.aspx?PersonId=4766). He has supervised 17 PhDs to successful completion to date and has published circa 170 refereed papers. He has received several international awards, including the 2006 Society of Manufacturing Engineers Total Excellence in Electronics Manufacturing Award (www.sme.org/teem/)

RESEARCH PROJECTS AND INCOME GENERATION

(For EPSRC grants please see http://gow.epsrc.ac.uk/NGBOViewPerson.aspx?PersonId=4766).

[1].       Strategic Partnership Project (under Erasmus + 2018 Call), circa €€264,305 cash from the EU, “3D FDM printer design and build curriculum for final year UG engineering degree programme (3DPRINT-DnB)”, Lead Partner with 6 other partners from the UK, Germany and Turkey, 36 month project, Grant Period: September 2018 – August 2021.

[2].       Royal Academy of Engineering Distinguished Visiting Fellowship Scheme (Round 7), Grant Ref DVF1718\7\31 (worth £4,855.00 in cash), “Virtual Laboratory for Development of Paste Materials used in Microsystems Assembly - Materials Dataset Framework”, with Professor Jae Pil Jung, University of Seoul, South Korea, Grant Period: 7th – 29th January 2017.

[3].       Royal Academy of Engineering Distinguished Visiting Fellowship Scheme (Round 6), Grant Ref DVF1617\6\28 (worth £3975 in cash), “Virtual Laboratory for Development of Paste Materials used in Microsystems Assembly”, with Professor Y. C. Chan, City University of Hong Kong, Grant Period: 9th October 2017 to 23rd October 2017.

[4].       Education Partnerships in Africa - British Council Funding, Grant Ref No EPA-3.31, (worth £59,800 in cash), “Developing high level employability skills through collaborative development of postgraduate programmes”, Academic Partners: Federal University of Technology, Owerri, University of Benin, Abia State University, Uturu, Abia State Nigeria, Grant Period: September 2009 to March 2011.

[5].       EPSRC CASE Grant Ref No: 04302873, (worth £65,000 in cash), “PowerPC Thermal Management and Performance Modelling”, Industrial Partners: British Aerospace Dynamics Plc, Rochester; Grant Period: December 2006 to November 2009.

[6].       EPSRC CASE Grant Ref No: 04302873, (worth £65,000 in cash), “Rheological Characterisation of Lead-free solder Pastes”, Industrial Partners: Henkel Technologies; Grant Period: March 2005 to February 2008.

[7].       EPSRC RAIS Grant GR/S22332/01 (worth £35,000 in cash), “Lead-free soldering for Flip-Chip Assembly Applications”, Industrial Partners: ITRI, Matra-BAe, Celestica, Multicore; Grant Period: November 2002 to October 2003.

[8].       ESRF Grenoble ME532 on ID11 (worth £33,000), “Temperature resolved micro structural characterization of lead-free solder joints using fine-focus X-Ray diffraction”, Industrial Partners: ITRI, Matra-BAe, Celestica, Multicore; Grant Period: December 2002 to June 2003

[9].       EPSRC Grant GR/R09206/01 and GR/R09206/02, (worth £149,788 in cash), “Microsystems Assembly Technology for the 21st Century”, (Industrial Partners: Hewlett Packard, Chemitron, Micro-Emissive Displays, Alpha/Cooksons, Celestica), Grant Period:  July 2001- June 2003.

[10].     ESRF Grenoble ME361 on ID11 (worth £34,000), “Detection and Characterisation of Intermetallic Compounds in Pb-free solder joints using High Energy micro-focus X-Ray diffraction”, Industrial Partners: ITRI, Matra-BAe, Celestica, Multicore; Grant Period: December 2001 to June 2002.

[11].     EPSRC Grant GR/N14125/01 and GR/N14125/02 (worth £133,246 in cash), “Lead-free soldering for Flip-Chip Assembly Applications”, Industrial Partners: ITRI, Matra-BAe, Celestica, Multicore; Grant Period: November 2000 to October 2002.

[12].     EPSRC/DTI Teaching Company Project, (worth £90,000 in cash), “Characterisation of multi-system dispersions in non-aqueous carriers”, (Industrial Partner: ColorMatrix Europe), Period: 01/02/2000 to 31/01/2002.

[13].     KOREA-UK Science and Technology Collaboration Fund, (worth £30,000 in Cash), “A study of fluxless micro-soldering for MEMS”, in collaboration with The University of Seoul, South Korea, Grant Period: January 2000-December 2002.

[14].     EPSRC CASE Quota Studentship (worth £37,500 cash), “Lead-free soldering for Micro-electronics Assembly”, Partner: Celestica; Grant Period: 01/04/1999 to 31/03/2002

[15].     EPSRC Grant GR/M39848/01 and GR/M39848/02 (with £142,000 in cash), “Rapid Configuration of Manufacturing Processes for agile supply chains”, Industrial partner: Celestica Ltd, Lucas Automotive Electronics; Grant Period: 01/01/1999 to 31/12/2002

[16].     EPSRC Grant GR/L59320/01 (with £201,990 in cash), “Characterisation and Modelling of the Rheology of Solder Pastes”, Industrial Partner:  Multicore Solders Ltd) Grant Period: 01/04/1997 to 31/03/2000. [Extended to 31/10/2000 due to RA resignation]

[17].     EPSRC Grant GR/L66113/01 (with £143,000 in cash), “Chip Scale Soldering Studies”, Industrial Partners: Celestica, DEK, BAe Dynamics, GPS, Multicore Solders; Grant Period: 01/08/1997 to 31/07/2000

[18].     EPSRC Total Technology Award (EPSRC ref. No:  97593026) £37,500, “Use of Lasers in PCB Manufacture”, Industrial Partners: Celestica Ltd; Grant Period: 01/10/1997 to 31/09/2000

[19].     ColorMatrix Europe PhD Studentship (worth over £30,000 in cash), “Characterisation of multi-system dispersions in non-aqueous carriers”, Industrial Partner: ColorMatrix Europe; Grant Period: 01/11/1998 to 31/10/2001

[20].     EPSRC CASE Quota Studentship (worth £37,500 cash), “Plasma Assisted Cleaning”, Industrial Partners: BAe Dynamics Ltd; Grant Period: 01/10/1996 to 31/09/1999.

[21].     Nortel sponsored Ph.D. Studentship (worth £25,000 cash), “Plasma Assisted Fluxless Soldering”, Grant Period:  01/10/1995 to 31/09/1998

[22].     EPSRC Grant GR/K76542/01 with £83,347 cash from the EPSRC, “Automatic Solder Paste Monitoring Inspection and Control”, Industrial Partners: DEK, D2D/ICL and 3D Scanners Ltd; Grant Period: 01/01/1995 to 31/12/1997

[23].     Salford University Research Committee (QS/S2/264/00) with £20,000 cash, “Electronics Micro-Assembly”, Industrial Partners: BAe and ICL; Grant Period: 01/02/1992 to 31/01/1993.

[24].     Industrial Sponsorship (from ICL, BAe, Nortel & DEK) worth £10,500 cash, “Implementation of SUPPA (Salford University Paste Printing Adviser)”, Grant Period: 01/08/1993 to 31/07/1995.

[25].     SERC Grant  GR/H 32939/01,  with  £113,335 cash from the SERC, “Process modelling of Solder Paste       Printing for the reflow soldering of Surface Mount Components”, Industrial Partners: ICL, BAe, Nortel, DEK & Alpha-Fry; Grant Period: 01/04/1992 to 31/03/1994.

Membership of professional bodies

Ndy is professionally active and he is a Senior Fellow of the Higher Education Academy (SFHEA, elected 2016), a Fellow of the Institution of Engineering and Technology (FIET, elected 2004), a Member of the Institution of Electrical Engineers (MIEE, 1992), a Chartered Engineer Registered with the UK Engineering Council (CEng, registered 1989), and a Member of the Institution of Production Engineers (GIProdE, 1988).

Professional Activities:

[1]. Member, EPSRC Peer Review College [2000-2002, 2005-2009, 2009 to Date]

[2]. The Parliamentary Scientific Committee (An Associate Parliamentary Group), Member Representing the University of Wolverhampton (2012- to date), www.scienceinparliament.org.uk

[3]. Academic Adviser for the Commonwealth Scholarships Commission in the UK (2013 to Date)

https://www.gov.uk/government/uploads/system/uploads/attachment_data/file/671985/Annual-Report-2017.pdf

[4]. Member of the Editorial Board, Academy Journal of Science and Engineering, Nigerian Defence Academy Nigeria (2017 to date), http://www.academyjsekad.edu.ng/editorial.html

[5]. International Editor, Journal of the Microelectronics and Packaging Society (2017 to date)

http://www.koreascience.or.kr/journal/AboutJournal.jsp?kojic=MOKRBW

 

Qualifications

Academic Qualifications

(a). Doctor of Philosophy Degree (PhD) in Manufacturing Engineering (1987), from University of Manchester Institute of Science and Technology (UMIST), Manchester, UK; (Thesis on Manufacturing Systems Modelling and Simulation

(b). Master of Science Degree (MSc) in Flexible Manufacturing Systems and Robotics (1984), from Loughborough University, Leicestershire, UK

(c). Batchelor of Engineering Degree (BEng with Honours) in Mechanical Engineering with 1st Class Honours (1981), from University of Nigeria, Nsukka, Nigeria

Professional Qualifications

SFHEA                 Senior Fellow of The Higher Education Academy (2016)

MNSE                  Member of the Nigerian Society of Engineers (2011)

FIET                    Fellow of the Institution of Engineering and Technology (2004)

MIEE                   Member of the Institution of Electrical Engineers (1992) 

CEng                   Chartered Engineer, Registered with UK Engineering Council, UK (1989)

GIProdE              Member of the Institution of Production Engineers (1988)

Publications

Ndy has authored and/or co-authored 2 book chapters; circa 170 papers in peer reviewed journals and refereed  conferences; and over 50 consultancy reports (for details, see: https://orcid.org/0000-0002-9955-8244Scopus Author ID: 35582918500 and https://www.researchgate.net/profile/NN_Ekere/reputation). His Journal and Conference papers are listed below.

Journal Papers

[1].  Ogbomo, O. O; E. H. Amalu, N.N. Ekere, P.O. Olagbegi (2018), “Effect of operating temperature on degradation of solder joints in crystalline silicon photovoltaic modules for improved reliability in hot climate”, Solar Energy, Vol 170, pp 682–693. https://doi.org/10.1016/j.solener.2018.06.007 

[2].  Ogbomo, O. O; E. H. Amalu, N.N. Ekere, P. O. Olagbegi, (2017), Effect of CTE mismatch of solder joint materials in photovoltaic (PV) modules operating in elevated temperature climate on the joint’s damage, Procedia Manufacturing, Vol 11, pp 1145–1152. https://doi.org/10.1016/j.promfg.2017.07.236

[3].  Ogbomo, O. O; E. H. Amalu, Ekere, N.N, and Olagbegi, P.O. (2017), “A review of photovoltaic module technologies for increased performance in tropical climate”, Renewable and Sustainable Energy Reviews, Vol. 75, pp1225-1238. https://doi.org/10.1016/j.rser.2016.11.109.

[4]       Zarmai, M. T., Ekere, N.N., Oduoza, C.F and Amalu, E. H. (2016), “Evaluation of thermo-mechanical damage and fatigue life of solar cell solder interconnections”, Robotics and Computer Integrated Manufacturing, Vol 47, pp 37-43, http://dx.doi.org/10.1016/j.rcim.2016.12.008

[5].      E.H. Amalu and N.N. Ekere (2016), “Modelling evaluation of Garofalo-Arrhenius creep model for lead-free solder joints in surface mount electronic component assemblies”, Journal of Manufacturing Systems, Volume 39, April 2016, Pages 9–23.  https://doi.org/10.1016/j.jmsy.2016.01.002

[6].      Zarmai, M.T., N.N. Ekere, C.F. Oduoza and E.H. Amalu (2016), “Optimization of thermo-mechanical reliability of solder joints in crystalline silicon solar cell assembly”, Microelectronics Reliability (Elsevier) Vol. 59, pp 117-125. https://doi.org/10.1016/j.microrel.2015.12.031

[7].      Zarmai, M. T., N. N. Ekere, C. F. Oduoza and E. H. Amalu (2015), “Effect of intermetallic compounds on thermo-mechanical reliability of lead-free solder joints in solar cell assembly”, Advanced Manufacturing, Electronics and Microsystems: TechConnect Briefs, Vol 4,  June 14, 2015, pp 286 – 289. https://briefs.techconnect.org/papers/effect-of-imc-thickness-on-thermo-mechanical-reliability-of-lead-free-solder-joints-in-solar-cell-assembly/

[8].      Amalu, E.H., Ekere, N.N., Zarmai, M.T., Takyi, G. (2015), “Optimisation of thermo-fatigue reliability of solder joints in surface mount resistor assembly using Taguchi method”, Finite Elements in Analysis and Design, Vol 107, December 2015, pp 13–27. https://doi.org/10.1016/j.finel.2015.08.004

[9].      Zarmai, M.T, N.N. Ekere, C.F. Oduoza and E.H. Amalu (2015), “A review of interconnection technologies for improved crystalline silicon solar cell photovoltaic module assembly”, Applied Energy, Volume 154. pp. 173-182. https://doi.org/10.1016/j.apenergy.2015.04.120

[10].    Sharma, A., Mallik, S., Ekere, N. N and Jung, J.P, (2014), “Printing Morphology and Rheological Characteristics of Lead-Free Sn-3Ag-0.5Cu (SAC) Solder Pastes”, Journal of the Microelectronics and Packaging Society, Volume 21, Issue 4, pp 83-89. https://core.ac.uk/download/pdf/154427933.pdf

[11].    Kumar, S, Mallik, S, Ekere, N, and Jung, J (2013), “Stencil Printing Behavior of Lead-Free Sn-3Ag-0.5Cu Solder Paste for Wafer Level Bumping for Sub-100 μm Size Solder Bumps”, Metals and Materials International. September 2013, Volume 19, Issue 5, pp 1083-1090. DOI : 10.6117/kmeps.2014.21.4.083

[12].    K.C. Otiaba, R.S. Bhatti, N.N. Ekere, S. Mallik, M. Ekpu (2013), “Finite element analysis of the effect of silver content for Sn–Ag–Cu alloy compositions on thermal cycling reliability of solder die attach”, Engineering Failure Analysis, Vol. 28, pp 192 – 207. https://doi.org/10.1016/j.engfailanal.2012.10.008

[13].    S. Mallik, E.H.L Chan, and N. Ekere (2013), “Nonlinear Viscoelastic Characteristics of Sn-Ag-Cu Solder Pastes Used in Electronics Assembly Applications”, Journal of Materials Engineering and Performance, Volume 22(4) April 2013, pp 1186 – 1193. https://doi.org/10.1007/s11665-012-0360-7

[14].    K.C. Otiaba, R.S. Bhatti, N.N. Ekere, S. Mallik, M.O. Alam, E.H. Amalu, and M. Ekpu (2012), “Numerical study on thermal impacts of different void patterns on performance of chip-scale packaged power device”, Microelectronics Reliability, Vol 52, pp 1409–1419. https://doi.org/10.1016/j.microrel.2012.01.015

[15].    E.H. Amalu and N.N. Ekere (2012), “Damage of lead-free solder joints in flip chip assemblies subjected to high-temperature thermal cycling”, Computational Materials Science Vol. 65 (2012), pp 470 – 484. https://doi.org/10.1016/j.commatsci.2012.08.005

[16] E.H. Amalu, N.N. Ekere (2012), Prediction of damage and fatigue life of high-temperature flip chip assembly interconnections at operations. Journal of Microelectronics Reliability, Volume 52, Issue 11, November 2012, Pages 2731-2743. http://dx.doi.org/10.1016/j.microrel.2012.04.004.

[17]     E.H. Amalu, N.N. Ekere, R.S. Bhatti, G. Takyi, A.O.A. Ibhadode (2012), “Numerical Investigation of Thermo-Mechanical Behaviour of Ball Grid Array Solder Joint at High Temperature Excursion”, Advanced Materials Research, Vol 367 pp287-292. https://doi.org/10.4028/www.scientific.net/AMR.367.287

[18]     E.H. Amalu, N.N. Ekere (2011), High temperature reliability of lead-free solder joints in a flip chip assembly. Journal of Materials Processing Technology, Volume 212, Issue 2, pp. 471 - 488. https://doi.org/10.1016/j.jmatprotec.2011.10.011

[19]     E.H. Amalu, N.N. Ekere, S. Mallik (2011), “Evaluation of rheological properties of lead-free solder pastes and their relationship with transfer efficiency during stencil printing process”. Materials and Design, vol. 32, pp. 3189-3197. https://doi.org/10.1016/j.matdes.2011.02.045  

[20]     K. C. Otiaba , R.S. Bhatti, N.N. Ekere, S. Mallik, M.O. Alam, E.H. Amalu, M. Ekpu, (2012), “Numerical study on thermal impacts of different void patterns on performance of chip-scale packaged power device, Microelectronics Reliability, Vol. 52, pp. 1409–1419. https://doi.org/10.1016/j.microrel.2012.01.015

[21]     K.C. Otiaba, N.N. Ekere, E.H. Amalu, R.S. Bhatti, S. Mallik (2012), “Thermal Management Materials for Electronic Control Unit: Trends, Processing Technology and R&D Challenges”, Advanced Materials Research, vol. 367. pp. 301-307. https://doi.org/10.4028/www.scientific.net/AMR.367.301

[22]     E.H. Amalu, W.K. Lau, N.N. Ekere, R.S. Bhatti, S. Mallik, K.C. Otiaba ,G. Takyi (2011), “A study of SnAgCu solder paste transfer efficiency and effects of optimal reflow profile on solder deposits”, Microelectronics Engineering, vol. 88. pp. 1610-1617. https://doi.org/10.1016/j.mee.2011.02.104

[23]     G. Takyi, E.H. Amalu, P.K. Bernasko, (2011) "Effect of solder joint integrity on the thermal performance of a TEC for a 980 nm pump laser module", Soldering & Surface Mount Technology, Vol. 23 Issue: 2, pp.115-119, https://doi.org/10.1108/09540911111120186

[24]     K.C. Otiaba, N.N. Ekere, R.S. Bhatti, S. Mallik, M.O. Alam, E.H. Amalu (2011), “Thermal interface materials for automotive electronic control unit: Trends, technology and R&D challenges”. Microelectronics Reliability, Vol. 51. Iss 12. pp. 2031-2043. https://doi.org/10.1016/j.microrel.2011.05.001

[25].    A.E. Marks, N.N. Ekere, S. Mallik, R. Bhatti, (2011) "Effect of particle size distribution (PSD) and flux medium on the creep recovery performance of lead‐free solder pastes", Soldering & Surface Mount Technology, Vol. 23 Issue: 2, pp.75-84, https://doi.org/10.1108/09540911111120140

[26].    Mallik, S., Ekere, N., Best, C. and Bhatti, R. (Feb 2011), “Investigation of thermal management materials for automotive electronic control units”, Applied Thermal Engineering, Vol. 31, Issues 2-3, pp. 355-362, Published online 18 Oct 2010. https://doi.org/10.1016/j.applthermaleng.2010.09.023

[27].    Mallik, S., Ekere, N. N., and Bhatti, R., (2010), "Empirical Modeling of the Time-Dependent Structural Build-up of Lead-Free Solder Pastes Used in the Electronics Assembly Applications," Journal of ASTM International, Vol. 7, No. 9, 2010, pp. 1-12, https://doi.org/10.1520/JAI103043

[28].    Mallik, S., Schmidt, M., Bauer, R. and Ekere, N. N. (2010), “Evaluating Solder Paste Behaviours through Rheological Test Methods and their Correlation to the Printing Performance”, Soldering & Surface Mount Technology, Vol. 22, Issue 4, pp. 42-49. https://doi.org/10.1108/09540911011076871

[29].    Takyi, G. and Ekere, N. N., (2010), “Investigation of the effect of nitrogen and air atmosphere on solder wettability of plasma-treated HASL finish PCBs”, Soldering and Surface Mount Technology, Vol. 22, Issue 3, pp. 17-21. https://doi.org/10.1108/09540911011054154

[30].    Takyi, G. and Ekere, N. N., (2010), “Study of the effects of PCB surface finish on plasma process time for lead-free wave soldering”, Soldering and Surface Mount Technology, Vol. 22, Issue 2, pp. 37-42. https://doi.org/10.1108/09540911011036271

[31].    Mallik, S., Ekere, N. N., Marks, A. E., Seman, A. and Durairaj, R. (2010), “Modeling the structural breakdown of solder paste using the structural kinetic model”, Journal of Materials Engineering and Performance, Vol. 19, No. 1, pp. 40 – 45. https://doi.org/10.1007/s11665-009-9448-0

[32].    Durairaj, R., Man, L. W., Ekere, N. N. and Mallik, S. (2010), “The effect of wall-slip formation on the rheological behaviour of lead-free solder pastes”, Materials & Design, Vol. 31, Issue 3, pp. 1056 – 1062. https://doi.org/10.1016/j.matdes.2009.09.051 

[33].    Mallik, S, Schmidt, M., Bauer, R. and Ekere, N. N. (2010), “Evaluating Solder Paste Behaviours through Rheological Test Methods and their Correlation to the Printing Performance”, Soldering and Surface Mount Technology, Volume 22, No 4, pp. 42-49. https://doi.org/10.1108/09540911011076871

[34].    Mallik, S, Ekere, N. N., Durairaj, R., Seman, A. and Marks, A. E. (2009), “Wall-slip Effects in SnAgCu Solder Pastes used in Electronics Assembly Applications”, Materials & Design, vol. 30, pp. 4502-4506. https://doi.org/10.1016/j.matdes.2009.05.028

[35].    Durairaj, R., Ramesha, S., Mallik, S., Seman, A. and Ekere, N. (2009), “Rheological characterisation and printing performance of Sn/Ag/Cu solder pastes”, Materials & Design, Vol 30, Issue 9, Oct 2009, pp 3812-3818, https://doi.org/10.1016/j.matdes.2009.01.028

[36]. Durairaj,  R., S. Mallik, A. Seman, A. Marks, N.N. Ekere, (2009), “Rheological characterisation of solder pastes and isotropic conductive adhesives used for flip-chip assembly”, Journal of Materials Processing Technology, Vol 209, Issue 8, pp. 3923–3930. https://doi.org/10.1016/j.jmatprotec.2008.09.013

[37].    Durairaj, R., Mallik, S., Seman, A., Marks, A. and Ekere, N. N., (2009), “Rheological characterisation of solder pastes and isotropic conductive adhesives used for flip-chip assembly”, Journal of Material Processing Technology, Vol 209, Iss 8, pp3923-3930. https://doi.org/10.1016/j.jmatprotec.2008.09.013

[38].    R. Durairaj, S. Mallik, N.N. Ekere. (2008), “Solder paste characterisation: towards the development of quality control (QC) tool”, Soldering and Surface Mount Technology, Vol. 20/3, pp. 33-40. https://doi.org/10.1108/09540910810885705

[39].    S. Mallik, N. N. Ekere, R. Durairaj and A. E. Marks, (2008), “An Investigation into the rheological characterisation properties of different lead-free solder pastes for surface mount applications”, Soldering and Surface Mount Technology, Volume 20, Issue 2, pages 3-10. https://doi.org/10.1108/09540910810871511

[40].    G. J. Jackson, M. W. Hendriksen, R. W. Kay, M. Desmulliez, R. K. Durairaj, and N. N. Ekere, (2005), ‘Sub-process challenges in ultra-fine pitch stencil printing of type-6 and type-7 pb-free solder pastes for flip chip assembly applications’,  Solder and Surface Mount Technology, Vol 17, No 1, 2005, 24-32. https://doi.org/10.1108/09540910510579212

[41].    Hillman, S. R, S. H. Mannan, R. Durairaj, A. Seman, N. N. Ekere, M. Dusek, C. Hunt, (2005), “Correlation between jamming and skipping during solder paste printing”, Solder and Surface Mount Technology, Vol 17, No 4, pp 17-26. https://doi.org/10.1108/09540910510630395

[42].    G. J. Jackson, H. Lu, R. K. Durairaj, N. Hoo, C. Bailey, N. N. Ekere, and J. Wright, (2004)   “Intermetallic Phase Detection in Lead-Free Solders Using Synchrotron X-ray Diffraction”,  Journal of Electronic Material, Vol 33, Issue 12 pp 1524-1529. https://doi.org/10.1007/s11664-004-0094-x

[43].Da He and N N Ekere (2004), “Effect of particle size ratio on the conducting percolation threshold of granular conductive–insulating composites”, Journal of Physics D: Applied Physics, Volume 37, Issue 13, pp. 1848-1852. https://doi.org/10.1088/0022-3727/37/13/019

[44].    R.Durairaj, D.He, N.N.Ekere and B.Salam, (2004), “Thixotropy flow behaviour of solder and conductive adhesives paste”, Journal of Material Science: Materials in Electronic, Vol 15, pp 677-683 https://doi.org/10.1023/B:JMSE.0000038923.62923.1e.

[45].    B. Salam, C. Virseda, H. Da, N.N. Ekere, R. Durairaj, (2004), “Reflow Profile Study of the Sn-Ag-cu Solder”, Soldering & Surface Mount Technology, Volume 16, Issue 1, 2004, pp. 27-34. https://doi.org/10.1108/09540910410517022

[46].    D. He, N.N. Ekere, B. Salam, D. Rajkumar, G. Jackson, (2003), “Monte Carlo Study of Solder Paste Microstructure and Ultra-fine-pitch Stencil Printing”, Journal of Materials Science: Materials in Electronics, no.14, 2003, pp. 501-506. https://doi.org/10.1023/A:1023929119055

[47].    Da He, N. N. Ekere, (2002) “Two-dimensional percolation and cluster structure of the random packing of binary disks”, Physical Review E Vol. 65, 061304 (2002). https://doi.org/10.1103/PhysRevE.65.061304 

[48].    R. Durairaj, G.J. Jackson, N.N. Ekere, G. Glinski, C. Bailey, (2002) “Correlation of solder paste rheology with computational simulations of the stencil printing process”, Soldering and Surface Mount Technology, Volume 14 No. 1, pp. 11-17. https://doi.org/10.1108/09540910210416422

[49].    B. Salam, N.N. Ekere, J.P. Jung, (2002), “A Study on the Comparison of Solderability Assessment”, Journal of the Korean Institute of Surface Engineering, Volume 35, No. 2, pp. 129-137. https://www.researchgate.net/publication/264112207

[50].    N. N. Ekere, D. He, and L. Cai, (2001) “The Influence of Wall Slip in the measurement of Solder Paste Viscosity”, IEEE Transactions on Components and Packaging Technologies, Vol. 24, No. 3, pp 468 – 473, September 2001. DOI: 10.1109/6144.946495

[51].    D. He and N. N. Ekere, (2001), “Structure Simulation of Concentrated Suspensions of Hard Spherical Particles,” AIChE Journal (American Institute of Chemical Engineers), Volume 47, pp. 53-59. https://doi.org/10.1002/aic.690470108

[52].    D. He, N. N. Ekere and L. Cai, (2001) “New Statistic Technique for Structure Evaluation of Particle Packing,” Materials Science & Engineering--A: Structural Materials, Microstructure and Processing, Vol 298, Issues 1-2, pp 209-215. https://doi.org/10.1016/S0921-5093(00)01284-3  

[53]     Park. C.B, S.M. Hong, J.P. Jung, N.N. Ekere, C.S. Kang and D. Rajkumar, (2001), “Study on the fluxless soldering of Sn-37Pb and Sn-3.5Ag solder using rolling”, Journal of Korea Institute of Metals and Materials, Vol. 39, Issue 7, 2001, pages 823-826. http://210.101.116.102/journal_korea/List_01.asp?

[54].    Durairaj, R, T. A. Nguty and N.N. Ekere, (2001), "Critical Factors Affecting paste flow during the stencil printing of solder paste", Soldering & Surface Mount Technology, 2001, Vol. 13 No 2, pp 30-34. https://doi.org/10.1108/09540910110385239

[55].    T. A. Nguty and N. N. Ekere, (2000), "The rheological properties of solder and solar pastes and the effect on stencil printing", Rheologica Acta, 39, pp 607-612.  https://doi.org/10.1007/s003970000117.

[56].    T. A. Nguty and N. N. Ekere (2000) "Modelling the effects of temperature on the rheology of solder pastes and flux system", Journal of Material Science: Materials in Electronics, Vol. 11, pp. 39-43. https://doi.org/10.1023/A:1008904220118

[57].    T. A. Nguty and N. N. Ekere, (2000) "Monitoring the effects of storage on the rheological properties of solder paste", Journal of Material Science: Materials in Electronics, Vol. 11, pp. 433-437. https://doi.org/10.1023/A:1008979523690

[58].    T. A. Nguty, D. Philpott and N. N. Ekere, Samuel Teckle, S. Budiman, and D. Rajkumar, (2000) "Rework techniques process evaluation for chip scale packages", IEEE Transactions on Electronics Packaging Manufacturing, Vol. 23, No. 3, pp.200-207.  DOI: 10.1109/6104.873248

[59].    T.A. Nguty, N.N. Ekere, J.D. Philpott, G.D. Jones, (2000) "Rework of CSP: the effect on surface intermetallic growth", Soldering & Surface Mount Technology, Vol. 12 Issue: 3, pp.35-38, https://doi.org/10.1108/09540910010347881.

[60].    T. A. Nguty and N. N. Ekere, (2000) "Modelling the effects of temperature on the rheology of solder pastes and flux system," Journal of Material Science: Materials in Electronics, Vol. 11, pp 39-43. https://doi.org/10.1023/A:1008904220118

[61].    T. A. Nguty and N. N. Ekere, (1999), "Modelling a low cost wafer bumping technique for flip chip application", Intl. Journal of Microcircuits and Electronics Packaging, Vol 22, no 4, pp 327-333. https://pdfs.semanticscholar.org/ffc2/c48738780d0f4ba27e37a68eb20b8c0230f2.pdf

[62].    T. A. Nguty and N. N. Ekere, (1999) "Flip Chip Assembly Stand-off Height Prediction For Solder Bumping Process", ASME Advances in Electronic Packaging, EEP-Vol 26, Issue 1, 1999, Vol 1, pp 55-63. https://www.tib.eu/en/search/id/BLCP%3ACN031572039/Modelling-of-Flip-Chip-Assembly-Stand-Off-Height/

[63].    M.W. Hendriksen, F.K. Frimpong, N.N. Ekere, (1999) "Interconnect solutions for advanced area array packaging", Microelectronics International, Volume 16 Issue: 2, pp. 49-54, https://doi.org/10.1108/13565369910268277 

[64].    Riedlin, M.H.A. and Ekere, N.N., (1999), “How Heat Generation in Stencil Printing Affects Solder Joint Quality”, Surface Mount Technology, Volume 13, pp. 74-97. http://smt.iconnect007.com/index.php/article/52535/-how-heat-generation-in-stencil-printing-affects-solder-joint-quality/52538/?skin=smt

[65]. Nguty, T.A. and Ekere, N.N., (1999), “Features-Chip Scale vs Flip Chip: Issues to Consider-Although further research is needed, these two options do offer current solutions to reducing size, weight and cost”, Circuits Assembly, Vol 10, No 11, pp. 26-33.

[66].    D. He, N.N. Ekere, and L. Cai, (1999) “Computer Simulation of Random Packing of unequal particles”, Physical Review E, December 1999, Vol. 60, Issue 6, pp. 7098-7104. DOI: 10.1103/PhysRevE.60.7098·  

[67].    M. A. Currie and N Ekere, (1998) "Stencil printing aperture emptying sub-process", Circuit Assembly, vol. 9, no. 11, November 1998, pp 40-51

[68].    D. He, N. N. Ekere, & M. A. Currie, (1998) "The behaviour of solder pastes in stencil printing using vibrating squeegee", IEEE Transactions Components Packaging Manufacturing Technology Part C, Vol. 21, No4, pp 317-324. DOI: 10.1109/TCPMC.1998.7102530

[69].    D. He and N. N. Ekere, (1998) "Computer simulation of compaction of powder of spherical particles", Journal of Material Science Letters, vol. 17, pp1723-1725, https://doi.org/10.1023/A:1006623201757

[70].    M. H. A Riedlin and N Ekere, (1997), "Solder Paste deposition for BGA Rework", Circuit Assembly, Vol 8, No. 11, November 1997, pp 48-55

[71].    R. M Horsley and N.N. Ekere, (1997) "Causes of Voiding in Plastic Ball Grid Array Eutectic solder joints", Soldering and Surface Mount Technology Journal, Vol. 9, No 3, September 1997, pp 18-22.

[72].    Haslehurst, L, Ekere, N, (1996) "Parameter Interactions in stencil printing of solder pastes", Journal of Electronics Manufacturing, Volume 6, Number 4, December 1996, pp. 307-316. https://doi.org/10.1142/S0960313196000251

[73].    Ekere, N, & D. He, (1996),  "The performance of vibrating squeegee in the stencil printing of solder pastes", Journal of Electronics Manufacturing, Volume 6, Number 4 pp 261 - 270. https://doi.org/10.1142/S0960313196000238

[74].    S H Mannan, N Ekere, I Ismail, & M A Currie, (1995) "Flow processes in Solder Paste Printing during Stencil Printing for SMT assembly", Journal of Material Science, Volume 6, pp 34-42. https://doi.org/10.1007/BF00208132

[75].    N Geren and N Ekere, (1994) "Solder dispensing in Robotic SMD Rework", Soldering and Surface Mount Technology Journal, Vol 6, Issue 1, February 1994, pp 21-25. https://doi.org/10.1108/eb037851

[76].    N Ekere, S H Mannan, E K Lo, (1994) "Mapping of manufacturing Process Modelling", Soldering and  Surface Mount Technology Journal, Vol. 6,, Issue 2,  pp 4-11. https://doi.org/10.1108/eb037861

[77].    S H Mannan, N Ekere, E K Lo and I Ismail, (1994) "Squeegee system study in the Stencil Printing of Solder Pastes", IEEE Transactions on Components, Hybrids and Manufacturing Technology, Volume 17, No 3, September 1994, pp 470-476. DOI: 10.1109/95.311758

[78].    S H Mannan, N Ekere, I Ismail and M A Currie, (1994) "Computer Simulation of Solder Paste Flow Part I: Dense Suspension Theory", Journal of Electronic Manufacturing, Vol 4, No 3, Oct 1994, pp 141-147. https://doi.org/10.1142/S0960313194000158

[79].    S H Mannan, N Ekere, I Ismail and M A Currie, (1994) "Computer Simulation of Solder Paste Flow Part II: Flow Processes", Journal of Electronic Manufacturing, Volume 4, Number 3, pp 149 - 154. https://doi.org/10.1142/S096031319400016X

[80].    C Y Chan, A H Redford and N Ekere, (1994) "Cell Controller Software Modelling", Soldering and Surface Mount Technology Journal, Vol. 6 Issue: 3, pp 46-49. https://doi.org/10.1108/eb037878

[81].    N Ekere, I Ismail, E K Lo, and S H Mannan, (1993) “Experimental Study of Stencil‑Substrate Separation Speed in solder paste Printing for reflow soldering", Journal of Electronics Manufacturing, Vol. 3, No 1, pp 25-29, April 1993. https://doi.org/10.1142/S0960313193000048

[82].    S H Mannan, N Ekere, E K Lo & I Ismail, (1993) "Application of ink Screening Models to solder paste printing in SMT assembly", Journal of Electronic Manufacturing, Volume 3, No. 3, pp. 113-120. https://doi.org/10.1142/S0960313193000139

[83].    S H Mannan, N Ekere, E K Lo and I Ismail, (1993) "Predicting Scooping and Skipping in Solder Paste Printing for Reflow Soldering of SMT Devices", Soldering and Surface Mount Technology Journal, Volume 5, Issue 3, pp. 14-17, October 1993. https://doi.org/10.1108/eb037835

[84].    E K Lo, N Ekere, S H Mannan and I Ismail, (1993) “The future of solder paste printing for SMT reflow soldering”, Soldering and Surface Mount Technology, Volume 5, Issue 1, pp 22 - 25, https://doi.org/10.1108/eb037811

[85].    N Ekere, E. K Lo, (1991) "New Challenges in Solder Paste Printing", Journal of Electronics Manufacturing, Vol. 1, No 1, pp29‑40, 1991. https://doi.org/10.1142/S0960313191000059

[86[. N. N. Ekere, (1991), Book reviews: "Solder paste in electronics packaging: Technology and Applications in Surface Mount, Hybrid Circuits and Components Assembly", Journal of Electronics Manufacturing, Vol. 01, No. 01, pp 57 – 59. https://doi.org/10.1142/S096031319100014X

[87].    N. Ekere, and R. G Hannam, (1989) "An Evaluation of methods for modelling and simulating manufacturing systems", International Journal of Production Research, Vol. 27, No 4, pp 599‑611. https://doi.org/10.1080/00207548908942571

Books and/or articles in books:

[88].    Durairaj, R., Lam Wai Man, Kau Chee Leong, Liew Jian Ping, N. N. Ekere and Lim Seow Pheng, (2013), Chapter 2: Rheological Characterisation of Diglycidylether of Bisphenol-A (DGEBA) and Polyurethane (PU) Based Isotropic Conductive Adhesives, in Rheology - New Concepts, Applications and Methods, Edited by Rajkumar Durairaj, ISBN 978-953-51-0953-2, pp 23-38, Publisher: InTech, Chapters published February 13, 2013, http://dx.doi.org/10.5772/53637.

[89].    N Ekere, R. G Hannam, "Modelling and Simulation of Manufacturing Systems", in Control and Dynamic Systems, Vol. 49, (C. T. Leondes, Editor), pp129‑190, Academic Press, 1991. https://doi.org/10.1016/B978-0-12-012749-8.50009-X

Conference Papers

[90].   Ogbomo, O.O, E.H. Amalu, N.N. Ekere, (2016), “Numerical study on effect of high-temperature on degradation of solder joints in photovoltaic module for improved reliability in hot climate”, Proceedings of 26th International Conference on Flexible Automation and Intelligent Manufacturing (FAIM 2016), KSTC, Seoul, Republic of Korea, 27-30 June 2016.

[91].   Amalu, E.H.; Ekere, N.N., Oduoza, C. F, and Zarmai, M.T, (2015), "Evaluation of Thermo-Mechanical Reliability of Solder Joints in Surface Mount Resistor Assembly", Flexible Automation and Intelligent Manufacturing, FAIM2015, 23-26 June 2015, Wolverhampton, UK.

[92].   Zarmai, M.T., Ekere, N.N., Oduoza, C. F, and Amalu, E.H. (2015), "Thermo-Mechanical Reliability of Lead-free Solder Joints in Solar Cell Assembly", Flexible Automation and Intelligent Manufacturing, FAIM2015,  23-26 June 2015, Wolverhampton, UK.

[93].   Njoku, J.E.; Mallik, S.; Bhatti, R.; Amalu, E.H.; Ekere, N.N., "Effect of component standoff height on thermo-mechanical reliability of ball grid array (BGA) solder joints operating in high-temperature ambient," in Electronics Technology (ISSE), 2015 38th International Spring Seminar, vol., no., pp.231-236, 6-10 May 2015

[94].   Amalu, E.H., N.N. Ekere, C. F. Oduoza and M. T. Zarmai, (2015), “Evaluation of Garofalo creep model for lead-free solder joints in surface mount components”, Proceedings of TechConnect World Innovation Conference 2015, Washington DC USA, June 14 – 17.

[95].   Zarmai, M.T., N.N. Ekere, C.F. Oduoza, and E.H. Amalu, “Effect of IMC thickness on thermo-mechanical reliability of lead-free solder joints in solar cell assembly”, Proceedings of TechConnect World Innovation Conference 2015, Washington DC USA, June 14 – 17.

[96]    E.H. Amalu, N.N. Ekere, G. Aminu (2011), Effects of intermetallic compound on high temperature reliability of flip chip interconnects for fine pitch applications. In: Proc 3rd IEEE International Conference on Adaptive Science & Technology, 24-26 November 2011, Abuja, Nigeria. pp. 208-214.

[97]    E.H. Amalu, N.N. Ekere, R.S. Bhatti, G. Takyi (2010), Investigation of Effects of Reflow Profile Parameters on Lead-free Solder Bump Volumes and Joint integrity In: Proc: International Conference on Advances in Materials and Processing Technologies (AMPT 2010), 24th-27th October 2010, Paris, France. American Institute of Physics, AIP Conf. Proc. Jan. 17, 2011. vol. 1315, pp. 639-644.

[98]    E.H. Amalu, N.N. Ekere, R.S. Bhatti (2009), High Temperature Electronics: R&D Challenges and Trends in Materials, Packaging and Interconnection Technology. In: Proc 2nd International Conference on Adaptive Science & Technology, 14-16 December 2009, Accra, Ghana, pp. 146-153.

[99]  K.C. Otiaba, R.S. Bhatti, N.N. Ekere, S. Mallik, E.H. Amalu, M. Ekpu (2011), Thermal effects of die-attach voids location and style on performance of chip level package. In: Proc 3rd IEEE International Conference on Adaptive Science & Technology, 24-26 November 2011, Abuja Nigeria. pp. 231-236.

[100]  M. Ekpu, R. Bhatti, N. Ekere, S. Mallik, E. Amalu, K. Otiaba (2011), Investigation of effects of heat sinks on thermal performance of microelectronic package. In: Proc 3rd IEEE International Conference on Adaptive Science & Technology, 24-26 November 2011, Abuja, Nigeria. pp. 127-131.

[101]  E.H. Amalu, N.N. Ekere, and G. Aminu (2011), “Modelling High Temperature Reliability of Flip Chip Pb-free Solder Joint at varying Bond Pad Diameter”, In proc: AES-ATEMA’ 2011 International Conference on Advances and Trends in Engineering Materials and their Applications, Montreal, Canada, 01-05 August, 2011, pp. 385-393.

[102]  E.H. Amalu, N.N. Ekere, R.S. Bhatti, G. Takyi, A.O.A. Ibhadode (2010), Numerical Investigation of Thermo-Mechanical Behaviour of Ball Grid Array Solder Joint at High Temperature Application. In Proc: 3rd International Conference on Engineering Research & Development: Advances in Engineering Science & Technology 7-9 September 2010, Benin City, Nigeria, pp. 1242-1251.

[103]  K.C. Otiaba, N.N. Ekere, E.H. Amalu R.S. Bhatti, S. Mallik, (2010), Thermal Management Materials for Electronic Control Unit: Trends, Processing Technology and R&D Challenges. In Proc: 3rd International Conference on Engineering Research & Development: Advances in Engineering Science & Technology 7-9 September 2010, Benin City, Nigeria, pp. 1270-1280.

[104]  Mallik, S., Bauer, R., Hübner, F and Ekere, N. N., (2010), “Evaluating print performance of Sn-Ag-Cu lead-free solder pastes used in electronics assembly process”, Advances in Materials and Processing Technologies Conference (AMPT), 24 – 27 Oct 2010, Paris, France.

[105]  Amalu, E., Lui, Y. T., Ekere, N., Bhatti, R. and Takyi, G. (2010), “Investigation of the Effects of Reflow Profile Parameters on Lead-free Bump Volumes and Joint Integrity”, Advances in Materials and Processing Technologies Conference (AMPT), 24 -27 Oct 2010, Paris, France.

[106]  Otiaba, K. C., Ekere, N. N., Amalu, E., Bhatti, R. and Mallik, S., (2010), “Thermal Management Materials for Electronic Control Unit: Trends, Processing Technology and R&D Challenges”, 3rd International Conference On Engineering Research and Development (ICERD 2010), 7 – 9 Sep 2010, Benin City, Nigeria.

[107]  Mallik, S, Thieme, J., Bauer, R. and Ekere, N. N. (2009), “Study of the Rheological behaviour of Sn-Ag-Cu Solder pastes and their correlation with printing performance”, Proceedings of 11th Electronics Packaging Technology Conference (EPTC 2009), Singapore 9-11 December 2009,.

[108]  Bernesko, P. K., Ekere, N. N., Mallik, S. and Seman, A. (2009), “Effect of Reflow Profiles and Thermal Cycle Ageing on the Intermetallic Formation and Growth in Lead-free Soldering”, Proceedings of 11th Electronics Packaging Technology Conference (EPTC 2009), 9 – 11 December Singapore.

[109]  Mallik, S, Ekere, N. N. Seman, A. and Durairaj, R. (2009), “Time-dependent Behaviour of Solder Pastes used in the Electronics Assembly Applications”, Proceedings of 11th Electronic Material and Packaging Conference (EMAP 2009), Penang, Malaysia, December 2009.

[110]  Durairaj, R., Lam, W. M., Ramesha, S., Lim, C. W., Eu, P. L., Ekere, N. N., Mallik, S. and Seman, A. (2009), “Investigation of Wall-slip Behaviour in Lead-free Solder Pastes and Isotropic Conductive Adhesives”, Proc of 11th Electronics Packaging Technology Conference (EPTC 2009), Singapore, 9 – 11 Dec. 2009.

[111]  Durairaj, R., Man, L. W., Mallik, S. and Ekere, N. N. (2009) “Thixotropic Studies of Lead-based Solder, Lead-free Solder and Conductive Adhesive Pastes”, Proceedings of 11th Electronic Material and Packaging Conference (EMAP 2009), Penang, Malaysia, December 2009.

[112]  Seman, A., Ekere, N. N., Ashenden, S. J., Mallik, S., Marks, A. E., and Durairaj, R., (2008) “Development of an In-situ, Non-destructive Ultrasonic Monitoring Technique for Solder Pastes”, 2nd Electronics Systemintegration technology conf., Sept 1-4, 2008, London, UK, pp. 209-214.

[113]  Marks, A. E., Mallik, S., Ekere, N. N. and Seman, A., (2008), “Effect of Temperature on Slumping Behaviour of Lead-Free Solder Paste and its Rheological Simulation”, 2nd Electronics Systemintegration technology conference, September 1-4, 2008, London, UK, pp. 829-832

[114]  Mallik, S., Schmidt, M., Bauer, R. and Ekere, N. N., (2008), “Influence of Solder Paste Components on Rheological Behaviour”, 2nd Electronics Systemintegration technology conference, September 1-4, 2008, London, UK, pp. 1135-1140

[115]  Mallik, S., Ekere, N. N., Marks, A. E., Seman, A. and Durairaj, R., (2008), “Modelling of the Time-dependent Flow Behaviour of Lead-Free Solder Pastes used for Flip-Chip Assembly Applications”, 2nd Electronics Systemintegration technology conf., 1-4 Sept, 2008, London, UK, pp. 1219-1223

[116]  Durairaj, R., Mallik, S., Seman, A., Marks, A. E. and Ekere, N. N., (2008) “Viscoelastic properties of solder pastes and isotropic conductive adhesives used for flip-chip”, 33rd International Electronics Manufacturing Technology Symposium (IEMT 2008)  2008, Malaysia

[117]  Ekere, N, Mallik, S., (2008) “A Methodology for Characterising New Lead-Free Solder Paste Formulations used for Flip-chip Assembly Applications”, The second international symposium on smart processing technology (SPT 07), Published in Smart Coating Technology, vol. 2, pp. 59 – 64.

[118]  Durairaj, R., S. Mallik, A. Seman, A. Marks and N.N. Ekere (2008) Investigation of Wall-slip Effect on Paste Release Characteristic in Flip chip Stencil Printing Process, 10th Electronics Packaging Technology Conference (EPTC), Singapore, pp. 1328-1333.

[119]  Seman A.,N.N. Ekere, S.J. Ashenden, S. Mallik, A. Marks, R. Durairaj (2008) In-situ Non-destructive Ultrasonic Rheology Technique for Monitoring Different Lead-free Solder Pastes for Surface Mount Applications, 10th Electronics Packaging Technology Conf. (EPTC), Singapore, pp. 1448-1454.

[120]  R. Durairaj, S. Mallik, A. Seman, A. Marks and N.N. Ekere (2008)  Viscoelastic properties of solder pastes and isotropic conductive adhesives used for flip-chip assembly, 33rd International Electronics Manufacturing Technology (IEMT) Conference Penang, Malaysia, pp. 1-8.

[121]  A. Seman, N.N. Ekere, S.J. Ashenden, S. Mallik, A.E. Marks, R. Durairaj (2008) Development of an In-situ, Non-destructive Ultrasonic Monitoring Technique for Solder Pastes, 2nd Electronics Systemintegration Technology Conference (ESTC) Greenwich, UK, pp.  209 - 214.

[122]  S. Mallik, N. N. Ekere, A. E. Marks, A. Seman and R. Durairaj (2008) Modelling of the Time-dependent Flow Behaviour of Lead-Free Solder Pastes used for Flip-Chip Assembly Applications, 2nd Electronics Systemintegration Technology Conf. (ESTC) Greenwich, UK, pp.  1219 - 1224.

[123]  Marks, A. E., Ekere, N. N., Mallik, S. and Durairaj, R., ‘Effect of Long-Term Ageing on the Rheological Characteristics and Printing Performance of Lead-Free Solder Pastes used for flip-chip assembly’, The second international symposium on smart processing technology (SPT 07), Nov 27-28, 2007, Osaka, Japan

[124]  S. Mallik, Ekere, N. N., Durairaj, R., and Marks, A. (2007), ‘A Study of the Rheological Properties of Lead Free Solder Paste Formulations used for Flip-Chip Interconnection’, 32nd International Electronics Manufacturing Technology Symposium, October 3-5 2007, San Jose, California, USA

[125]  A. Marks, Mallik, S., Durairaj, R. and Ekere, N. N. (2007), ‘Effect of Abandon Time on Print Quality and Rheological Characteristics for Lead-Free Solder Pastes used for Flip-Chip Assembly’, 32nd Intl Electronics Manufacturing Technology Symposium (IEMT 2007) October 3-5 2007, San Jose, California, USA

[125]  R. Durairaj, Mallik, S., Marks, A., Winter, M., Bauer, R. and Ekere, N. N. (2006), ‘Rheological Characterisation of New Lead-Free Solder Paste Formulations for Flip-Chip Assembly’, Proceedings of ESTC (Electronics Systemintegration Technology Conf.), Dresden, Germany, pp 995 – 1000.

[127]  N. N. Ekere, Mallik, S., ‘A Methodology for Characterising New Lead-Free Solder Paste Formulations used for Flip-chip Assembly Applications’, Proceedings of the 2nd International Symposium on Smart Processing Technology (SPT 07), Nov 27-28, 2007, Osaka, Japan.

[128]  A. E. Marks, Ekere, N. N., Mallik, S. and Durairaj, R., ‘Effect of Long-Term Ageing on the Rheological Characteristics and Printing Performance of Lead-Free Solder Pastes used for flip-chip assembly’, Proc of the 2nd International Symposium on Smart Processing Technology (SPT 07), Nov 27-28, 2007, Osaka, Japan.

[129]  N. N. Ekere, “A Study of the Effect of Solder Volume on Inter-metallic Layer Growth Rate in lead-free solder joints”, Invited Paper - Int Welding/Joining Conference, IWJC-Korea 2007, 10-12th May 2007.

[130]  R. Durairaj, A. Seman and N.N. Ekere, “Development of Quality Control (QC) Tools for Solder Pastes used for Flip Chip Assembly based on Oscillatory Test”, Electronics Systemintegration Technology Conference, Dresden Germany 5-7th September 2006

[131]  B. Salam, N. N. Ekere and R. Durairaj, “A Study of Intermetallic Compounds Formation and Growth in Sn-Ag-Cu Lead-free Solder Joints”, Electronics Systemintegration Technology Conference, Dresden Germany 5-7th September 2006

[132]  M. Winter, R. Durairaj, N.N. Ekere, R. Bauer, “Rheological Characterization of Solder Pastes with Different Procedures”, 29th International Spring Seminar on Electronics Technology, ISSE 2006, May 10-14, 2006, Dresden/St. Marienthal, Germany

[133]  Robert Kay, Marc Desmulliez, Stoyan Stoyanov, Chris Bailey, Rajkumar Durairaj, Nnamdi Ekere, Mike Hendriksen, Frank Frimpong, Brian Smith, Dennis Price, Andrew Roberts, Mark Whitmore, Peter Ongley, James Gourley, ‘Low Temperature Flip-chip Packaging based on Stencil Printing Technology’, to be presented in Microtech, IMAPS, UK,  2003

[134]  R. W. Kay, M. P. Desmulliez, C. Bailey, S. Stoyanov, G. Glinski, N. Ekere, R. Durairaj, M. Hendriksen, B. Smith, P. Ongley, D. Price, A. Roberts, M. Whitmore, J. Gourley  “Low Temperature Flip-Chip Packaging based on Screen Printing Technology”, IMAPS-UK MicroTech Conf, Stratford-upon-Avon, October 2nd 2003

[135]  R. W. Kay, M .P. Desmulliez, C. Bailey, S. Stoyanov, G. Glinski, N. Ekere, R. Durairaj, M. Hendriksen, B. Smith, P. Ongley, D. Price, A. Roberts, M. Whitmore, J. Gourley  “A High Volume, Low Cost and Low Temperature MEMS Packaging Technology Based on a Flip-Chip Assembly Process”, Micro System Technology Conference, Munich, October 8th 2003

 

Experience in industry

Ndy has many years’ experience of working directly with over 50 manufacturing companies on EPSRC and industry funded projects and on knowledge transfer partnerships (please see http://gow.epsrc.ac.uk/NGBOViewPerson.aspx?PersonId=4766); through which he has established links with industry R&D Groups in the UK and abroad. His other industry and industry related experience include:

(a). Mechanical Engineer, Shell Petroleum Development Corporation, Warri Nigeria (1982- 1983). He worked in Project Construction and Terminals Operations; where he undertook major projects in the pipelines and crude oil storage terminals Department. A major highlight of his time with Shell was the commissioning of Odidi-2 crude oil Flowstation, for which he served as the Project Construction and Commissioning Engineer.

(b). Post-Doctoral Research Assistant, Manufacturing and Machine Tools Division, UMIST (1987 – 1988). He worked on an industry-led SERC/ACME project on Tool Management; focused on the development and implementation of Tooling Relational Database for managing and controlling tools in a Flexible Manufacturing System. This SERC project was in partnership with Sandvik Coromat and Leyland Bus.

(c). Post-Doctoral Research Fellow, Computation Department, UMIST (1988-1989), He worked as the lead Researcher on an industry-led SERC Project in partnership with Logica and Unilever; focused on the development of decision support tools for Computer Aided Production Management.

 

Further information

Employment History

2013 – 2016      Dean, Faculty of Science & Engineering (Professor of Manufacturing), University of Wolverhampton, Wolverhampton WV1 1LY, UK

2012 - 2013      Dean of School of Technology and Professor of Manufacturing Engineering, University of Wolverhampton, Wolverhampton WV1 1LY, UK

2002–2012        Dean of School (and Professor of Manufacturing Processes), School of Engineering, University of Greenwich, Pembroke, Chatham Maritime, Kent ME4 4TB, UK

1992-2002        Associate Head and Director of Research, School of Aeronautical, Mechanical and Manufacturing Engineering, University of Salford, Salford M5 4WT, UK

1998‑2002        Professor of Manufacturing Engineering, School of Aeronautical, Mechanical, and Manufacturing Engineering, University of Salford, Salford M5 4WT, UK

1989-1998        Lecturer (and later Senior Lecturer) in Manufacturing Engineering, School of Aeronautical, Mechanical, and Manufacturing Engineering, University of Salford, Salford M5 4WT, UK

1989 (April-Nov) Lecturer in Manufacturing Engineering (Temporary), Industrial and Production Engineering Dept., Nottingham Trent University, Nottingham

1988‑1989        Post‑Doctoral Associate, SERC Grant (GR/E 82255), Decision Technologies Group, Computation Department, UMIST, Manchester, UK.

1987‑1988        Project Assistant, SERC/ACME project on Tool Management, MMT Division,

1982‑1983        Mechanical Engineer, Project Construction and Terminals Operations, Shell Petroleum Corporation, Warri, Nigeria