Professor Nduka Nnamdi Ekere

Title

Professor of Manufacturing Engineering

Photo

 

Contact Details

Email: ndyekere@wlv.ac.uk
Telephone: +44(0)1902 321 852
Fax:            +44(0)1902 321 459

Education & Qualifications:

  • 2004 - Fellow of the Institution of Electrical Engineers, United Kingdom (now FIET).
  • 1992 - Chartered Engineer (CEng), Member of the Institution of Electrical Engineers, UK (MIEE).
  • 1985-1987 - PhD in Manufacturing Engineering, UMIST, Manchester, UK (1987)
  • 1983-1984 - MSc in FMS & Robotics, Loughborough University, Loughborough Leicestershire, UK, (1984)
  • 1976-1981 - First Class BEng (Honours) in Mechanical Engineering, University of Nigeria, Nsukka, (1981)

Prizes & Awards:

  • July 1979: The PZ Annual Prize for best 3rd Year student in Applied Mechanics of Machines (Department of Mechanical Engineering, University of Nigeria, Nsukka)
  • July 1981: The University Prize for the best final-year student in the Department of Mechanical Engineering (University of Nigeria, Nsukka)
  • July 1981: Dr C. C. Agbim Prize for excellence for the best final-year project in the Faculty of Engineering (University of Nigeria, Nsukka)
  • May 1982: Federal Government of Nigeria scholarship for PG Research Studies (MSc/PhD) in the UK
  • Nov 1995: Vice-Chancellor's research excellence award, University of Salford
  • July 1997: Vice-Chancellor's research excellence award, University of Salford
  • Apr 1998: MCB University Press Award for Excellence: Prize for the Outstanding Paper 1997,  Soldering and Surface Mount Journal [“Causes of voiding in plastic ball grid array eutectic solder joints”, Vol. 9, No 3, October 1997, pp 18-22]
  • Apr 2006: Society of Manufacturing Engineering Total Excellence in Electronics Manufacturing Award
  • Jan 2007: Royal Society Visiting Professorship Award (with City University of Hong Kong)
  • Aug 2008: Visiting Professor, University of Applied Sciences, Dresden, Germany

Work Experience in Education & Industry

  • 2012 -  Dean of School and Professor of Manufacturing, School of Technology, University of Wolverhampton, Wulfruna Street, City Campus North, Wolverhampton WV1 1LY, UK
  • 2002 - 2012: Dean of School and Professor of Manufacturing, School of Engineering, University of Greenwich, Medway Campus, Pembroke, Chatham Maritime, Kent ME4 4TB, UK
  • 2005 - 2009: Member of Board of Governors, West Kent College, Tonbridge, Kent TN9 2PW
  • 1998 - 2002: Professor of Manufacturing Engineering, School of Aeronautical, Mechanical and Manufacturing Engineering, University of Salford, Salford M5 4WT, UK
  • 1999 - 2002: Director, Centre for Aeronautical & Mechanical Engineering Research, University of Salford
  • 1996 - 1998: Senior Lecturer in Manufacturing Engineering, University of Salford, Salford M5 4WT
  • 1989 - 1996: Lecturer in Manufacturing Engineering, University of Salford, Salford, M5 4WT UK
  • 1989 - 1989: Lecturer in Manufacturing Engineering (Temporary), Industrial and Production Engineering Department, Nottingham Trent University, Nottingham
  • 1988 - 1989: Post-Doctoral Associate, SERC Grant (GR/E 82255), Decision Technologies Group, Computation Department, University of Manchester Institute of Science and Technology, Manchester (UMIST)
  • 1987 - 1988: Project Assistant, SERC/ACME project on Tool Management MMT  Division,Mechanical Engineering Department, UMIST
  • 1982 - 1983: Mechanical Engineer, Project Construction and Terminals Operations, Shell Petroleum Corporation, Warri, Nigeria

Corporate Role within University of Greenwich

  • 2003 - 2012: Chair of Medway Campus Health and Safety Committee, University of Greenwich
  • 2008 - 2009: Chair of the Heads of School Group, University of Greenwich

Membership of Professional Bodies

  • CEng - Chartered Engineer (Manufacturing), UK Engineering Council
  • FIEE - Fellow of the Institution of Electrical Engineers (Institution of Engineering & Technology, FIET)

Professional Activities

  • Member, EPSRC Peer Review College [2000-2002, 2005 - 2009, 2009 – to present]
  • External Referee, Science and Engineering Research Council, Hong Kong [1998 to 2004]
  • Member of Court of Governors, West Kent College [2005 to 2009]
  • Member, EPSRC Engineering Responsive Advisory Panel E [1999]
  • External Examiner, Engineering Programmes, Kings College University of London [2010- to date]
  • External Examiner, Mechanical & Manufacturing Engineering, Faculty of Engineering, Science and the Built Environment, London South Bank University (2005 to 2011)
  • External Examiner, BEng/BSc/MSc, Glasgow Caledonian University, Glasgow [2001 - 2005]
  • External Examiner, MSc in CAD/CAM, Kings College University of London [1999-2002]
  • Part-Time Registered FEFC Inspector – NW England for Engineering/Technology (1992-1996).
  • PhD External Examiner for several Universities (including Imperial College, Loughborough, South Bank, Sheffield Hallam, Nottingham Trent University)
  • Member of the Int’l Board of Editors of the Journal of Electronics Manufacturing (1994 – 2003)
  • Member of the IEEE/IEMT Symposium Program Committee [1998 to 2008]
  • Member of the Micro System Technologies Conference Committee [2003 to 2008]
  • Chair for the 23rd IEEE/IEMT [Austin/Texas] Panel on Board Level Assembly
  • Chair for the 24th IEEE/CMPT IEMT Symposium [Austin/Texas, October 1999] Advanced Packaging II Session
  • Chair for the 25th IEEE/CMPT IEMT Symposium [Santa Clara, CA/USA, October 2000] Panel on Packaging Reliability
  • Chair for the 2003Micro System Technologies 2003 Conference [Munich, Germany, 7-8 October 2003] Panel on Integrated Processes.

Teaching Interests

  • Electronics Manufacturing and Assembly
  • Materials Characterisation and Modelling
  • Process Modelling and Simulation of Manufacturing Systems
  • Requirements capture and supply chain management

My research interests are in the modelling of manufacturing processes and systems, with specific emphasis on the Electronics Manufacturing and Assembly, and the Processing of soft solids. I have an established record for generating research grant income. Between 1993 and 2012, I generated some £1,500,000 (cash) in research funding from EPSRC and from industry. I also have an established record for publishing in refereed academic journals and for postgraduate supervision in these fields. I now have 130+ papers published in refereed academic journals and presented at national and international conferences. I led the Electronics Manufacturing Engineering Research Group (EMERG,), and for the 2008 RAE my work was submitted under the General Engineering Unit of Assessment (the sub-panel feedback on my submission states, “The outputs were of a largely international standard with the vast majority in the internationally recognised to internationally excellent range. Several outputs dealing with solder joint reliability were identified by the sub-panel as world-leading”).  I have received several awards for my research, including the 2007 Royal Society International Visiting Professorship (with the City University of Hong Kong) and the Society of Manufacturing Engineering 2006 Total Excellence in Electronics Manufacturing Award (SME website: http://www.sme.org/teem & http://w3.gre.ac.uk/pr/pressreleases/A1234.htm ).

Research Supervision

  • Previously supervised 15 PhD students to successful completion
  • Currently supervising 2 PhD students
  • Previously supervised 3 Knowledge Transfer Partnership projects to successful completion

Research Grants & Consultancy Contracts

  • Successfully completed 22 Research Grants/Contracts worth over £1,500,000 between 1992 and 2012
  • Collaboration and Consultancy for 40+ manufacturing companies

Publications (2009 - Present)

Authored/co-authored over 130 refereed journal/conference papers, 2 book chapters, and 50+ consultancy project reports. Please see listing of recent Journal and Conference publications below.

Journal Papers

  1. E.H. Amalu, N.N. Ekere (2012), Prediction of damage and fatigue life of high-temperature flip chip assembly interconnections at operations. Journal of Microelectronics Reliability, January, 2012. http://dx.doi.org/10.1016/j.microrel.2012.04.004.
  2. E.H. Amalu, N.N. Ekere, R.S. Bhatti, G. Takyi, A.O.A. Ibhadode (2012), Numerical Investigation of Thermo-Mechanical Behaviour of Ball Grid Array Solder Joint at High Temperature Excursion; Advanced Materials Research Trans Tech Publications Switzerland, vol. 367. pp. 287-292.
  3. E.H. Amalu, N.N. Ekere, R.S. Bhatti (2012), “High-temperature fatigue life of flip chip lead-free solder joints at varying component stand-off height”, Article in press at Journal of Microelectronics Reliability. 
  4. Mallik, Sabuj, Erica Hiu Laam Chan, Ndy Ekere, “Nonlinear Viscoelastic Characteristics of Sn-Ag-Cu Solder Pastes Used in Electronics Assembly Applications”, Journal of Materials Engineering and Performance, September 2012, pp. 154 - 159
  5. E.H. Amalu, N.N. Ekere (2011), High temperature reliability of lead-free solder joints in a flip chip assembly. Journal of Materials Processing Technology, Vol. 212, pp. 471 - 488.
  6. E.H. Amalu, N.N. Ekere, S. Mallik (2011), Evaluation of rheological properties of lead-free solder pastes and their relationship with transfer efficiency during stencil printing process. Materials and Design, vol. 32. pp. 3189-3197.  
  7. K. C. Otiaba , R.S. Bhatti, N.N. Ekere, S. Mallik, M.O. Alam, E.H. Amalu, M. Ekpu, (2012),Numerical study on thermal impacts of different void patterns on performance of chip-scale packaged power device. Microelectronics Reliability, vol. 52. pp. 1409–1419.
  8. K.C. Otiaba, N.N. Ekere, E.H. Amalu, R.S. Bhatti, S. Mallik (2012), Thermal Management Materials for Electronic Control Unit: Trends, Processing Technology and R&D Challenges. Advanced materials research Trans Tech Publications Switzerland, vol. 367. pp. 301-307.
  9. E.H. Amalu, W.K. Lau, N.N. Ekere, R.S. Bhatti, S. Mallik , K.C. Otiaba ,G. Takyi (2011), A study of SnAgCu solder paste transfer efficiency and effects of optimal reflow profile on solder deposits, Microelectronics Engineering, vol. 88. pp. 1610-1617.
  10. G. Takyi, E.H. Amalu, P.K. Bernasko (2011), Effect of Solder Joint Integrity on the Thermal Performance of TEC for a 980 nm Pump Laser Module. Soldering & Surface Mount Technology, vol. 23. Issue 2. pp. 115-119.
  11. K.C. Otiaba, N.N. Ekere, R.S. Bhatti, S. Mallik, M.O. Alam, E.H. Amalu (2011), Thermal interface materials for automotive electronic control unit: Trends, technology and R&D challenges. Microelectronics Reliability, vol. 51. Issue 12. pp. 2031-2043.
  12. Marks, A.E, Ekere N.N, Mallik, S and Bhatti R. (2011) “Effect of Particle Size Distribution (PSD) and Flux Medium on the Creep Recovery Performance of Lead-Free Solder Pastes”. Journal of Soldering and Surface Mount Technology, Vol. 23, No 2, pp. 75-84
  13. Mallik, S., Ekere, N., Best, C. and Bhatti, R. (Feb 2011), “Investigation of thermal management materials for automotive electronic control units”, Applied Thermal Engineering, Vol. 31, Issues 2-3, pp. 355-362, Published online 18 Oct 2010.
  14. Mallik, S., Ekere, N. N. and Bhatti, R., (Oct 2010) “Empirical Modeling of the Time-dependent Structural Build-up of Lead Free Solder Pastes used in the Electronics Assembly Applications”, Journal of ASTM International, Vol. 7, No. 9, Paper ID: JAI103043
  15. Mallik, S., Schmidt, M., Bauer, R. and Ekere, N. N. (2010), “Evaluating Solder Paste Behaviours through Rheological Test Methods and their Correlation to the Printing Performance”, Soldering & Surface Mount Technology, Vol. 22, Issue 4, pp. 42-49.
  16. Takyi, G. and Ekere, N. N., (2010), “Investigation of the effect of nitrogen and air atmosphere on solder wettability of plasma-treated HASL finish PCBs”, Soldering and Surface Mount Technology, Vol. 22, Issue 3, pp. 17-21.
  17. Takyi, G. and Ekere, N. N., (2010), “Study of the effects of PCB surface finish on plasma process time for lead-free wave soldering”, Soldering and Surface Mount Technology, Vol. 22, Issue 2, pp. 37-42.
  18. Mallik, S., Ekere, N. N., Marks, A. E., Seman, A. and Durairaj, R. (2010), “Modeling the structural breakdown of solder paste using the structural kinetic model”, Journal of Materials Engineering and Performance, Vol. 19, No. 1, pp. 40 – 45.
  19. Durairaj, R., Man, L. W., Ekere, N. N. and Mallik, S. (2010), “The effect of wall-slip formation on the rheological behaviour of lead-free solder pastes”, Materials & Design, Vol. 31, Issue 3, pp. 1056 – 1062.
  20. Mallik, S., Ekere, N. N., Marks, A. E., Seman, A. and Durairaj, R. (2009), “Modeling the structural breakdown of solder paste using the structural kinetic model”, Journal of Materials Engineering and Performance, Article in Press, published online doi: 10.1007/s11665-009-9448-0.
  21. Mallik, S, Schmidt, M., Bauer, R. and Ekere, N. N. (2010), “Evaluating Solder Paste Behaviours through Rheological Test Methods and their Correlation to the Printing Performance”, Soldering and Surface Mount Technology, Volume 22, No 4, pp. 42-49
  22. Mallik, S, Ekere, N. N., Durairaj, R., Seman, A. and Marks, A. E. (2009), “Wall-slip Effects in SnAgCu Solder Pastes used in Electronics Assembly Applications”, Materials & Design, vol. 30, pp. 4502-4506.
  23. Durairaj, R., Ramesha, S., Mallik, S., Seman, A. and Ekere, N. (2009), “Rheological characterisation and printing performance of Sn/Ag/Cu solder pastes”, Materials & Design, published online doi:10.1016/j.matdes.2009.01.028.
  24. Durairaj,  R., S. Mallik, A. Seman, A. Marks, N.N. Ekere, “Rheological characterisation of solder pastes and isotropic conductive adhesives used for flip-chip assembly”, Journal of Materials Processing Technology, Volume 209, Issue 8, 21 April 2009, pp. 3923–3930

Conference Papers

  1. E.H. Amalu, N.N. Ekere, G. Aminu (2011), Effects of intermetallic compound on high temperature reliability of flip chip interconnects for fine pitch applications. In: Proc 3rd IEEE International Conference on Adaptive Science & Technology, 24-26 November 2011, Abuja, Nigeria. pp. 208-214.
  2. E.H. Amalu, N.N. Ekere, R.S. Bhatti, G. Takyi (2010), Investigation of Effects of Reflow Profile Parameters on Lead-free Solder Bump Volumes and Joint integrity In: Proc: International Conference on Advances in Materials and Processing Technologies (AMPT 2010), 24th-27th October 2010, Paris, France. American Institute of Physics, AIP Conf. Proc. Jan. 17, 2011. vol. 1315. pp. 639-644.
  3. E.H. Amalu, N.N. Ekere, R.S. Bhatti (2009), High Temperature Electronics: R&D Challenges and Trends in Materials, Packaging and Interconnection Technology. In: Proc 2nd International Conference on Adaptive Science & Technology, 14-16 December 2009, Accra, Ghana, pp. 146-153.
  4. K.C. Otiaba, R.S. Bhatti, N.N. Ekere, S. Mallik, E.H. Amalu, M. Ekpu (2011), Thermal effects of die-attach voids location and style on performance of chip level package. In: Proc 3rd IEEE International Conference on Adaptive Science & Technology, 24-26 November 2011, Abuja Nigeria. pp. 231-236.
  5. M. Ekpu, R. Bhatti, N. Ekere, S. Mallik, E. Amalu, K. Otiaba (2011), Investigation of effects of heat sinks on thermal performance of microelectronic package. In: Proc 3rd IEEE International Conference on Adaptive Science & Technology, 24-26 November 2011, Abuja, Nigeria. pp. 127-131.
  6. E.H. Amalu, N.N. Ekere, G.  Aminu (2011), Modeling High Temperature Reliability of Flip Chip Pb-free Solder Joint at varying Bond Pad Diameter. In proc: AES-ATEMA’ 2011 International Conference on Advances and Trends in Engineering Materials and their Applications, Montreal, Canada, 01-05 August, 2011, pp. 385-393.
  7. E.H. Amalu, N.N. Ekere, R.S. Bhatti, G. Takyi, A.O.A. Ibhadode (2010), Numerical Investigation of Thermo-Mechanical Behaviour of Ball Grid Array Solder Joint at High Temperature Application. In Proc: 3rd International Conference on Engineering Research & Development: Advances in Engineering Science & Technology 7-9 September 2010, Benin City, Nigeria, pp. 1242-1251.
  8. K.C. Otiaba, N.N.Ekere, E.H. Amalu R.S. Bhatti, S. Mallik, (2010), Thermal Management Materials for Electronic Control Unit: Trends, Processing Technology and R&D Challenges. In Proc: 3rd International Conference on Engineering Research & Development: Advances in Engineering Science & Technology 7-9 September 2010, Benin City, Nigeria, pp. 1270-1280.
  9. Mallik, S., Bauer, R., Hübner, F and Ekere, N. N., (2010), “Evaluating print performance of Sn-Ag-Cu lead-free solder pastes used in electronics assembly process”, Advances in Materials and Processing Technologies Conference (AMPT), 24 – 27 Oct 2010, Paris, France.
  10. Amalu, E., Lui, Y. T., Ekere, N., Bhatti, R. and Takyi, G. (2010), “Investigation of the Effects of Reflow Profile Parameters on Lead-free Bump Volumes and Joint Integrity”, Advances in Materials and Processing Technologies Conference (AMPT), 24 -27 Oct 2010, Paris, France.
  11. Otiaba, K. C., Ekere, N. N., Amalu, E., Bhatti, R. and Mallik, S., (2010), “Thermal Management Materials for Electronic Control Unit: Trends, Processing Technology and R&D Challenges”, 3rd International Conference On Engineering Research and Development (ICERD 2010), 7 – 9 Sep 2010, Benin City, Nigeria.
  12. Mallik, S, Thieme, J., Bauer, R. and Ekere, N. N. (2009), “Study of the Rheological behaviour of Sn-Ag-Cu Solder pastes and their correlation with printing performance”, Proceedings of 11th Electronics Packaging Technology Conference (EPTC 2009), Singapore 9-11 December 2009,.
  13. Bernesko, P. K., Ekere, N. N., Mallik, S. and Seman, A. (2009), “Effect of Reflow Profiles and Thermal Cycle Ageing on the Intermetallic Formation and Growth in Lead-free Soldering”, Proceedings of 11th Electronics Packaging Technology Conference (EPTC 2009), 9 – 11 December Singapore.
  14. Mallik, S, Ekere, N. N. Seman, A. and Durairaj, R. (2009), “Time-dependent Behaviour of Solder Pastes used in the Electronics Assembly Applications”, Proceedings of 11th Electronic Material and Packaging Conference (EMAP 2009), Penang, Malaysia, December 2009.
  15. Durairaj, R., Lam, W. M., Ramesha, S., Lim, C. W., Eu, P. L., Ekere, N. N., Mallik, S. and Seman, A. (2009), “Investigation of Wall-slip Behaviour in Lead-free Solder Pastes and Isotropic Conductive Adhesives”, Proceedings of 11th Electronics Packaging Technology Conference (EPTC 2009), Singapore, 9 – 11 December.
  16. Durairaj, R., Man, L. W., Mallik, S. and Ekere, N. N. (2009) “Thixotropic Studies of Lead-based Solder, Lead-free Solder and Conductive Adhesive Pastes”, Proceedings of 11th Electronic Material and Packaging Conference (EMAP 2009), Penang, Malaysia, December 2009.