Name Emeka Hyginus Amalu
Job Title Postdoctoral Research Fellow
Faculty Faculty of Science and Engineering
School School of Engineering
Subject(s) Mechanical and Manufacturing Engineering
Tel 01902 322263
Email E.Amalu@wlv.ac.uk

‌‌‌Image

Emeka Amalu is a Postdoctoral Research Fellow with the University of Wolverhampton, UK and previously was a Senior Lecturer with the University of Benin, Nigeria. He is a Chartered Engineer (CEng) and in membership of the Institution of Mechanical Engineers (IMechE) as well as the Institution of Engineering and Technology (IET). He has achieved the status of Fellow of Higher Education Academy (FHEA).

Emeka obtained a PhD Degree from the University of Greenwich, London and also holds a Master of Engineering Degree as well as a Bachelor of Engineering Degree. In addition, he obtained a Postgraduate Certificate Academic Practice in Higher Education from the University of Wolverhampton. Emeka lectured Engineering Mechanics; Thermodynamics and Fluids to undergraduate Engineering Students in the University of Wolverhampton in 2013/14 session; and was the module leader to two modules in that session. His effective teaching practice earned him nomination for the Inspirational Lecturer Award 2013/14 session awarded by the University of Wolverhampton student union. He has lectured variety of Engineering Modules over six years of lectureship in the University of Benin, Nigeria.

In his current research, Emeka employs Computer Aided Engineering (CAE) and Finite Element Analysis (FEA) using ANSYS software, to model and provide solutions to engineering problems associated with reliability predictions of systems and processes, with specific emphasis on electronics interconnects, assembly, packaging and manufacture. He has also developed competence and expertise in rheological characterisation of soft solids. Emeka has experience in postgraduate research supervision. He has excellent record in publishing - having published over 35 papers in peer refereed academic journals. In addition, he has presented the findings from his research work in many national and international conferences; and his research outputs were included in Research Excellence Framework (REF) submission under Engineering in 2014. Emeka’s outstanding performance in research, publishing over nine journal articles and many conference papers during his PhD studies earned him the Prize for Best PhD Student 2012, awarded by the School of Engineering, University of Greenwich, London.

His remit is to combine scientific knowledge, mathematics and modelling skills to provide solutions to societal engineering problems. 

Emeka’s areas of expertise include:

  • Engineering Mechanics.
  • Fluid mechanics.
  • Computer aided manufacturing.
  • Systems reliability.

Emeka’s research interests are in the areas of Electronics, Soft solids, sustainable energy and Systems’ modelling. These include:

 

  • Electronics:

Electronics manufacturing, assembly and reliability.

3-D Electronics packaging.

Package-on-package modelling and reliability

Flip chip package reliability.

  • Soft solids:

Solder paste rheological characterisation.

Solder paste stencil print performance evaluation.

 

  • Sustainable energy:

Photovoltaic module interconnection failure.

Optimisation of Photovoltaic module assembly parameter for improved reliability.

  • Systems Modelling:

Computer Aided Engineering.

Finite Element Analysis of systems using ANSYS’s software.

Emeka is in membership of professional bodies which include:

  • Engineering Council, Chartered Engineer (CEng).
  • Fellow of the Higher Education Academy (FHEA).
  • Member of the Institution of Mechanical Engineers (MIMechE).
  • Member of the Institution of Engineering and Technology (MIET).

(A)        TEXTBOOK

[1]     E.H. Amalu (2014), Flip chip assembly: Modelling the joints’ high-temperature    

         reliability. LAP-LAMBERT Academic Publishing, Deutschland / Germany. ISBN: 978-3-  

         659-62465-0.

           

(B)         SELECTED JOURNAL ARTICLES

[2]     E.H. Amalu, N.N. Ekere, M.T. Zarmai and C.F. Oduoza (2014), Optimisation of flip

          chip assembly using finite element and Taguchi methods. In press, Metals and   

          Materials International, Seoul, Korea.

 

[3]   E.H. Amalu, N.N. Ekere (2012), Damage of lead-free solder joints in flip chip   assemblies subjected to high-temperature thermal cycling. Computational Materials Science, vol. 65. pp. 470-484.

 

[4]     E.H. Amalu, N.N. Ekere (2012), High-temperature fatigue life of flip chip lead-free  

          solder joints at varying component stand-off height. Microelectronics Reliability, vol.  

          52. pp. 2982-2994.

 

[5]   E.H. Amalu, N.N. Ekere (2012), Prediction of damage and fatigue life of high-temperature flip chip assembly interconnections at operations. Microelectronics Reliability, vol. 52. pp. 2731-2743.

 

[6]     E.H. Amalu, N.N. Ekere (2012), High temperature reliability of lead-free solder joints in a flip chip assembly. Journal of Materials Processing Technology, vol. 212. pp. 471-488.

 

[7]     E.H. Amalu, N.N. Ekere, R.S. Bhatti, G. Takyi, A.O.A. Ibhadode (2012), Numerical Investigation of Thermo-Mechanical Behaviour of Ball Grid Array Solder Joint at High Temperature Excursion. Advanced materials research Trans Tech Publications Switzerland, vol. 367. pp. 287-292.

 

[8]    Musa T. Zarmai1*, N.N. Ekere, C.F.Oduoza and Emeka H. Amalu (2015), A review of interconnection technologies for improved crystalline silicon solar cell photovoltaic module assembly. Accepted for publication in Journal of Applied Energy.

 

[9]     K.C. Otiaba, N.N. Ekere, E.H. Amalu, R.S. Bhatti, S. Mallik (2012), Thermal Management Materials for Electronic Control Unit: Trends, Processing Technology and R&D Challenges. Advanced materials research Trans Tech Publications Switzerland, vol. 367. pp. 301-307.

 

[10]   E.H. Amalu, N.N. Ekere, S. Mallik (2011), Evaluation of rheological properties of lead-free solder pastes and their relationship with transfer efficiency during stencil printing process. Materials and Design, vol. 32. pp. 3189-3197.  

 

[11]   E.H. Amalu, W.K. Lau, N.N. Ekere, R.S. Bhatti, S. Mallik, K.C. Otiaba ,G. Takyi (2011), A study of SnAgCu solder paste transfer efficiency and effects of optimal reflow profile on solder deposits, Microelectronics Engineering, vol. 88. pp. 1610-1617.

 

[12]    E. H. Amalu (2012), Modelling of the reliability of flip chip lead-free solder joints at   

         high-temperature excursions.PhD thesis, University of Greenwich, London.

 

[13]   G. Takyi, E.H. Amalu, P.K. Bernasko (2011), Effect of Solder Joint Integrity on the Thermal Performance of TEC for a 980 nm Pump Laser Module. Soldering & Surface Mount Technology, vol. 23. Iss 2. pp. 115-119.

                                                                                                                 

[14]   K.C. Otiaba, N.N. Ekere, R.S. Bhatti, S. Mallik, M.O. Alam, E.H. Amalu (2011), Thermal interface materials for automotive electronic control unit: Trends, technology and R&D challenges. Microelectronics Reliability, vol. 51. Iss. 12. pp. 2031-2043.

 

[15]   K. C. Otiaba , R.S. Bhatti, N.N. Ekere, S. Mallik, M.O. Alam, E.H. Amalu, M. Ekpu, (2012),Numerical study on thermal impacts of different void patterns on performance of chip-scale packaged power device. Microelectronics Reliability, vol. 52. pp. 1409–1419.

 

[16]   A.O.A. Ibhadode, E.H. Amalu (2006), Indigenous Development of a 3 hp Petrol Engine. Nigerian Journal of Engineering Research and Development. vol. 5, No. 1, pp. 20-35.

 

[17]   E.H. Amalu, A.O.A. Ibhadode (2007), 3 Hp Petrol Engine Piston Manufacture by Reverse Engineering Approach. Nigerian Journal of Engineering Research and Development. vol. 5, No.4, pp. 16-21.

 

[18]   E.H. Amalu, A.O.A. Ibhadode, A.E. Ameh (2007), Manufacture of a 3hp Petrol Engine Connecting Rod by Reverse Engineering Approach. Nigerian Journal of Engineering Research and Development. vol. 6, No.1, pp. 28-35. 

 

[19]   E.H. Amalu, A.O.A. Ibhadode (2007), 3 Hp Petrol Engine Block Fabrication by Reverse Engineering Approach. Nigerian Journal of Engineering Research and Development. vol. 6, No.2.

 

[20]   E.H. Amalu, A.O.A. Ibhadode (2007), Engine Spare Parts Production through Copy Manufacture and Substitution Approach. Advanced Materials Research, Trans Tech Publication Ltd Switzerland. vol. 18-19. pp. 475-480.

 

 

(C)       SELECTED CONFERENCE PAPERS

[21]  E.H. Amalu, N.N. Ekere, C.F. Oduoza and M.T. Zarmai (2015),  Evaluation of Garofalo    

         Creep Model for Lead-free Solder Joints in Surface Mount Components. In:   

         Conference proceedings of TechConnect World Innovation Conference and Expo   

         Gaylord National Resort and Convention Center Maryland, June 14-17.

 

[22]  M.T. Zarmai, N. N. Ekere, C. F. Oduoza, E. H. Amalu (2015), Effect of IMC thickness   

         on thermo-mechanical reliability of lead-free solder joints in solar cell assembly, In:    

         Conference proceedings of TechConnect World Innovation Conference and Expo   

         Gaylord National Resort and Convention Center Maryland, June 14-17.

 

[23] E. H. Amalu, N.N. Ekere, C.F Oduoza  and M.T. Zarmai (2015), Optimisation of  

       thermo-mechanical reliability of solder joints in surface mount resistor. Paper accepted   

       in the International Conference on Flexible Automation and Intelligent Manufacturing    

       (FAIM), University of Wolverhampton, UK, 23-26 June.

 

[24] Musa T. Zarmai*, N.N. Ekere, C.F. Oduoza, E. H. Amalu (2015), Thermo-mechanical  

       reliability of lead-free solder joints in solar cell assembly. Paper accepted in the    

       International Conference on Flexible Automation and Intelligent Manufacturing    

       (FAIM), University of Wolverhampton, UK, 23-26 June.

 

[25] J. E. Njoku, Sabuj Mallik Raj Bhatti, E. H. Amaluand N.N. Ekere (2015),Effect of component standoff height on thermo-mechanical reliability of Ball Grid Array (BGA) solder joints operating in high-temperature ambient. In Proc. of 38th Internationals Spring Seminar on Electronics Technology “Novel Trend in Electronics Manufacturing” Eger, Hungary, 6-10 May.

 

[26] E. H. Amalu, N. N. Ekere, Musa T. Zarmai (2014), Thermo-mechanical reliability of lead-free solder joints in flip chip package for high-temperature applications. In Proc First International Symposium on Industrial Design Engineering (ISIDE14),Karabuk, Turkey, May 8-9.

 

 

[27] E.H. Amalu, N.N. Ekere, G. Aminu (2011), Effects of intermetallic compound on high temperature reliability of flip chip interconnects for fine pitch applications. In: Proc 3rd IEEE International Conference on Adaptive Science & Technology, Abuja, Nigeria, 24-26 November, pp. 208-214.

 

[28]   E.H. Amalu, N.N. Ekere, R.S. Bhatti, G. Takyi (2010), Investigation of Effects of Reflow Profile Parameters on Lead-free Solder Bump Volumes and Joint integrity In: Proc: International Conference on Advances in Materials and Processing Technologies (AMPT 2010), 24th-27th October 2010, Paris, France. American Institute of Physics, AIP Conf. Proc. Jan. 17, 2011. vol. 1315. pp. 639-644.

 

 

 

[29]   E.H. Amalu, N.N. Ekere, R.S. Bhatti (2009), High Temperature Electronics: R&D Challenges and Trends in Materials, Packaging and Interconnection Technology. In: Proc 2nd International Conference on Adaptive Science & Technology, 14-16 December 2009, Accra, Ghana, pp. 146-153.

 

[30]   E.H. Amalu, N.N. Ekere, G.  Aminu (2011),Modeling High Temperature Reliability of Flip Chip Pb-free Solder Joint at varying Bond Pad Diameter. In proc: AES-ATEMA’ 2011 International Conference on Advances and Trends in Engineering Materials and their Applications, Montreal, Canada, 01-05 August, 2011, pp. 385-393.

 

[31]   E. H. Amalu(2012), Study of the effect of Inter-Metallic Compound thickness on    

          Damage and Fatigue Life of Lead-free Flip Chip Solder Joints at High Temperature   

          Excursions. In Proc: International Welding/Joining Conference, Korea.

 

[32]   E.H. Amalu, N.N. Ekere, R.S. Bhatti, G. Takyi, A.O.A. Ibhadode (2010), Numerical Investigation of Thermo-Mechanical Behaviour of Ball Grid Array Solder Joint at High Temperature Application. In Proc: 3rd International Conference on Engineering Research & Development: Advances in Engineering Science & Technology Benin City, Nigeria, 7-9 September, pp. 1242-1251.

 

[33]   K.C. Otiaba, R.S. Bhatti, N.N. Ekere, S. Mallik, E.H. Amalu, M. Ekpu (2011), Thermal effects of die-attach voids location and style on performance of chip level package. In: Proc 3rd IEEE International Conference on Adaptive Science & Technology, Abuja Nigeria, 24-26 November, pp. 231-236.

 

[34]   M. Ekpu, R. Bhatti, N. Ekere, S. Mallik, E. Amalu, K. Otiaba (2011), Investigation of effects of heat sinks on thermal performance of microelectronic package. In: Proc 3rd IEEE International Conference on Adaptive Science & Technology, Abuja, Nigeria, 24-26 November, pp. 127-132.

 

[35]   K.C. Otiaba, N.N.Ekere, E.H. Amalu R.S. Bhatti, S. Mallik, (2010), Thermal Management Materials for Electronic Control Unit: Trends, Processing Technology and R&D Challenges. In Proc: 3rd International Conference on Engineering Research & Development: Advances in Engineering Science & Technology, Benin City, Nigeria, 7-9 September, pp. 1270-1280.

 

[36]   E.H. Amalu, A.O.A. Ibhadode (2006), Engine Spare Parts Manufacture byReverse Engineering Approach. In proc: International Conference on Engineering Research and Development: Impact on Industry (1CER&D), Faculty of Engineering, University of Benin, Nigeria, 5-7 Sept. pp. 581-584.